Design and Application of Wave-Absorbing Materials in Integrated Circuits
DOI:
https://doi.org/10.66000/3110-9772.2026.02.02Keywords:
Wave-absorbing materials, Integrated circuits, Electromagnetic interference, Electronic packaging, Multilayer structureAbstract
The relentless drive toward higher density, higher operating frequencies, and heterogeneous integration in integrated circuits (ICs) has exacerbated electromagnetic interference (EMI) issues. Conventional shielding materials suffer from high density, susceptibility to corrosion, and secondary pollution due to their reflection dominant mechanism. In response, this review focuses on electromagnetic wave absorbing materials as a core solution for IC electromagnetic protection. Key design strategies—including magnetic dielectric synergy, core shell architectures, three dimensional porous/network structures, and multilayer/gradient configurations—are systematically examined. Their synthesis via solution based coating, template methods, and additive manufacturing is also discussed. Furthermore, the integration of absorbing materials into advanced packaging technologies—wafer level packaging (WLP), 2.5D/3D packaging, and system in package (SiP)—is analyzed, highlighting the specific EMI challenges of each platform and the corresponding absorber deployment schemes. Despite significant progress, challenges remain in the precise fabrication of complex structures, compatibility with CMOS processes, and multi physics (electrical thermal mechanical) coupling under real operating conditions. Future efforts should focus on multi scale structural regulation, multifunctional integration (absorption packaging heat dissipation), and intelligent design to achieve lightweight, ultra thin, and dynamically tunable absorbers. This review aims to provide a comprehensive reference for the design and application of wave absorbing materials in next generation high performance integrated circuits.
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